Design and optimization of photonic interconnect for heterogenous integration

Rakesh Krishna VS; Rui Zhang; Mohan Kathaperumal; Fuhan Liu; Madhavan Swaminathan; Ali Adibi

doi:10.1117/12.2590744

5 March 2021 Design and optimization of photonic interconnect for heterogenous integration

Rakesh Krishna VS, Rui Zhang, Mohan Kathaperumal, Fuhan Liu, Madhavan Swaminathan, Ali Adibi

Proceedings Volume 11694, Photonic and Phononic Properties of Engineered Nanostructures XI; 1169424 (2021) https://doi.org/10.1117/12.2590744
Event: SPIE OPTO, 2021, Online Only

Conference Poster

Abstract

We propose an interconnect model for multi-chip modules based on integration of a silicon photonic chip with single-mode polymer waveguides fabricated on the low-cost glass interposer technology. We present a detailed power-budget analysis of the on-chip photonic interconnect capable of 1 Tb/s chip-to-chip interconnection bandwidth. For this analysis, we consider state-of-the art photonics foundry modulators and detectors. We also discuss efficient-coupling strategies between the interconnect waveguides and the silicon photonic chip. Our analysis identifies key design parameters impacting the overall performance of the proposed interconnection approach in terms of energy-consumption, distance, and bandwidth and compare its performance with alternative approaches.

Conference Presentation

Citation Download Citation

Rakesh Krishna VS, Rui Zhang, Mohan Kathaperumal, Fuhan Liu, Madhavan Swaminathan, and Ali Adibi "Design and optimization of photonic interconnect for heterogenous integration", Proc. SPIE 11694, Photonic and Phononic Properties of Engineered Nanostructures XI, 1169424 (5 March 2021); https://doi.org/10.1117/12.2590744

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