MEMS for multispectral imaging

Mariusz Martyniuk; K. K. M. B. Dilusha Silva; Gino Putrino; Hemendra Kala; Dhirendra Kumar Tripathi; Lorenzo Faraone

doi:10.1117/12.2616831

5 March 2022 MEMS for multispectral imaging

Mariusz Martyniuk, K. K. M. B. Dilusha Silva, Gino Putrino, Hemendra Kala, Dhirendra Kumar Tripathi, Lorenzo Faraone

Proceedings Volume 12005, Smart Photonic and Optoelectronic Integrated Circuits 2022; 1200505 (2022) https://doi.org/10.1117/12.2616831
Event: SPIE OPTO, 2022, San Francisco, California, United States

Abstract

The anticipated feature of future generation remote infrared (IR) sensing and imaging technologies includes adding so called multi-colour capabilities. Such enhancement of the current state-of-the-art IR detector and imaging focal plane array (FPA) technologies allows real-time spectral information to be gathered from multiple wavelength bands. Multi/hyper-spectral imaging results in improved target recognition and is applicable to numerous remote sensing spectroscopy/imaging applications. In order to provide a reduced size, weight and power (SWaP) solution, a micro electromechanical systems (MEMS) based electrically tuneable adaptive filter technology has been developed for important IR bands of the electromagnetic spectrum. The adopted approach is capable of delivering on-chip remote hyper/multi-spectral sensing by obtaining narrow-band spectral sensitivity utilising a tuneable MEMS optical filter fabricated directly on a detector. This paper summarizes the performance demonstrated within the most technologically relevant bands of short-wave IR (SWIR, 1.4-2.5 µm), mid-wave IR (MWIR, 3-5 µm), and long-wave IR (LWIR, 8-12 µm). In SWIR, the demonstrated nanometer-scale uniformity in the flatness of suspended MEMS allows for spatial uniformity of the filtered peak centre wavelength and the achieved 30-35 nm spectral width to remain within single nanometers over 500µm x 500µm optical apertures. In LWIR, the spatial peak wavelength selectivity variation is achieved to be less than 1.2% across 200μm × 200μm optical imaging areas, exceeding the requirements for passive multispectral thermal imaging and validating the suitability for mechanically robust multi/hyper-spectral remote sensing and imaging applications deployable on low-SWaP field-portable platforms.

Conference Presentation

Citation Download Citation

Mariusz Martyniuk, K. K. M. B. Dilusha Silva, Gino Putrino, Hemendra Kala, Dhirendra Kumar Tripathi, and Lorenzo Faraone "MEMS for multispectral imaging", Proc. SPIE 12005, Smart Photonic and Optoelectronic Integrated Circuits 2022, 1200505 (5 March 2022); https://doi.org/10.1117/12.2616831

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