Presentation + Paper
5 March 2022 Tensile-strained direct bandgap GeSnOI micro/nanostructures by harnessing residual strain
Author Affiliations +
Proceedings Volume 12006, Silicon Photonics XVII; 1200605 (2022) https://doi.org/10.1117/12.2608742
Event: SPIE OPTO, 2022, San Francisco, California, United States
Abstract
Combining Sn alloying and tensile strain to Ge has emerged as the most promising engineering approach to create an efficient Si-compatible lasing medium. The residual compressive strain in GeSn has thus far made the simple geometrical strain amplification technique unsuitable for achieving tensile strained GeSn. Herein, by utilizing two unique techniques, we report the introduction of a uniaxial tensile strain directly into GeSn micro/nanostructures. By converting GeSn from indirect to direct bandgap material via tensile strain, we achieve a 10-fold increase in the light emission intensity.
Conference Presentation
© (2022) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Daniel Burt, Hyo-Jun Joo, Youngmin Kim, Yongduck Jung, Melvina Chen, Manlin Luo, Dong-Ho Kang, Simone Assali, Lin Zhang, Bongkwon Son, Weijun Fan, Oussama Moutanabbir, Zoran Ikonic, Chuan Seng Tan, Yi-Chiau Huang, and Donguk Nam "Tensile-strained direct bandgap GeSnOI micro/nanostructures by harnessing residual strain", Proc. SPIE 12006, Silicon Photonics XVII, 1200605 (5 March 2022); https://doi.org/10.1117/12.2608742
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KEYWORDS
Tin

Nanowires

Germanium

Raman spectroscopy

Transmission electron microscopy

Laser applications

Luminescence

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