Geiger-mode avalanche photodiode arrays fabricated on SOI engineered-substrates

Kevin K. Ryu; Brian F. Aull; Michael Collins; Noah Pestana; Joseph Ciampi; Rabindra Das; Kevan Donlon; Hermanus Pretorius; Meera Punjiya; Alex McIntosh; Erik K Duerr

doi:10.1117/12.2618610

30 May 2022 Geiger-mode avalanche photodiode arrays fabricated on SOI engineered-substrates

Kevin K. Ryu, Brian F. Aull, Michael Collins, Noah Pestana, Joseph Ciampi, Rabindra Das, Kevan Donlon, Hermanus Pretorius, Meera Punjiya, Alex McIntosh, Erik K Duerr

Author Affiliations +

Proceedings Volume 12089, Advanced Photon Counting Techniques XVI; 120890C (2022) https://doi.org/10.1117/12.2618610
Event: SPIE Defense + Commercial Sensing, 2022, Orlando, Florida, United States

Abstract

Arrays of Geiger-mode avalanche photodiodes (GmAPDs) are fabricated on a new type of engineered substrates with an epitaxial layer grown on silicon-on-insulator (SOI) wafers. The SOI-based structure facilitates rapid die-level bump bonding of the GmAPD array to a CMOS readout integrated circuit (ROIC) followed by substrate removal to make a backilluminated image sensor. To fabricate the engineered substrate, a commercial substrate with a 70-nm-thick SOI layer is implanted with BF2 ions to create a p+-doped passivation layer on the light illumination surface. Subsequently, a lightly p-doped silicon layer on which the GmAPD will be fabricated is grown using a homoepitaxy process. This approach allows for the use of chip-level hybridization to CMOS, avoiding the high cost and demanding wafer flatness and smoothness requirements of wafer-scale 3D integration processes. The new process yields cleaner wafers and allows for tighter control of detector layer thickness compared to the previous process. GmAPDs fabricated on 5-μm-thick epitaxial silicon have over 70% photon detection efficiency (PDE) when 532 nm light is focused into the center 3 μm of the device with an oxide layer that remains after substrate removal. With an anti-reflective coating, the PDE can be improved.

Conference Presentation

Citation Download Citation

Kevin K. Ryu, Brian F. Aull, Michael Collins, Noah Pestana, Joseph Ciampi, Rabindra Das, Kevan Donlon, Hermanus Pretorius, Meera Punjiya, Alex McIntosh, and Erik K Duerr "Geiger-mode avalanche photodiode arrays fabricated on SOI engineered-substrates", Proc. SPIE 12089, Advanced Photon Counting Techniques XVI, 120890C (30 May 2022); https://doi.org/10.1117/12.2618610

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available