Poster + Presentation + Paper
30 May 2022 Residual compressive stresses as a barrier to crack propagation and a way to increase resistance to brittle fracture in nanostructured systems
Author Affiliations +
Conference Poster
Abstract
Fatigue microcracks, caused by mechanical or thermal impacts, are formed during periodic stretching and compression of the upper layers of nanostructured materials. Then, the microcracks grow further and merge, leading to the cleavage of the material fragment and its subsequent destruction. In this work, we have performed calculations and transfer showing that it is necessary to structure nanomaterials in such a way as to form residual compressive stresses, which can serve as a barrier to crack propagation, in them. Here we also show that shear stresses are largely responsible for initiating the microcrack formation in nanostructured materials.
Conference Presentation
© (2022) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Marina A. Volosova, Mars S. Migranov, Vladimir P. Tabakov, and Petr M. Pivkin "Residual compressive stresses as a barrier to crack propagation and a way to increase resistance to brittle fracture in nanostructured systems", Proc. SPIE 12091, Image Sensing Technologies: Materials, Devices, Systems, and Applications IX, 120910I (30 May 2022); https://doi.org/10.1117/12.2623065
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KEYWORDS
Nanostructuring

Crystals

Thin film coatings

3D modeling

Resistance

Solids

Tin

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