Vibration insensitive fiber optic spectral interferometric probe for metrology of topography and thickness of multilayer samples

Wojtek J. Walecki

doi:10.1117/12.2631783

3 October 2022 Vibration insensitive fiber optic spectral interferometric probe for metrology of topography and thickness of multilayer samples

Wojtek J. Walecki

Author Affiliations +

Proceedings Volume 12223, Interferometry XXI; 122230I (2022) https://doi.org/10.1117/12.2631783
Event: SPIE Optical Engineering + Applications, 2022, San Diego, California, United States

Abstract

We describe a metrology system allowing for the reduction of the errors caused by vibration of the production floor and allowing for measurements of the thickness of wafers in motion. This is accomplished by performing simultaneous measurements of spectra containing interference signals containing distance information using two or more probes positioned on both sides of the measured wafer on the same detector at the same time.

Conference Presentation

Citation Download Citation

Wojtek J. Walecki "Vibration insensitive fiber optic spectral interferometric probe for metrology of topography and thickness of multilayer samples", Proc. SPIE 12223, Interferometry XXI, 122230I (3 October 2022); https://doi.org/10.1117/12.2631783

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