Presentation + Paper
14 March 2023 Buried-regrown-implant-structure diode lasers with ultra-thick epitaxy for resistance to mounting stress without loss in efficiency
B. King, S. Arslan, A. Boni, P. Della Casa, D. Martin, A. Thies, A. Knigge, P. Crump
Author Affiliations +
Proceedings Volume 12403, High-Power Diode Laser Technology XXI; 124030J (2023) https://doi.org/10.1117/12.2647096
Event: SPIE LASE, 2023, San Francisco, California, United States
Abstract
Epi-down mounting can degrade performance in broad area lasers when the stress field extends into the active region. Thick p-side epitaxial layers have the potential to isolate the device from external stress, but add electrical resistance and losses from current spreading. Therefore, we use two-step epitaxy to combine highly-doped p-side epitaxial layers (2x thicker than conventional) with a resistive oxygen-implanted layer located close to the active region to block lateral current spreading. The resulting buried-regrown-implant-structure (BRIS) lasers with 100 μm stripes and lasing wavelength of 915 nm show high efficiency (peak of 67%, 55% at 20 W) and high lateral brightness (3.3 W/mm·mrad up to 17.5 W output power), improved over reference devices, in spite of the thick p-side.
Conference Presentation
© (2023) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
B. King, S. Arslan, A. Boni, P. Della Casa, D. Martin, A. Thies, A. Knigge, and P. Crump "Buried-regrown-implant-structure diode lasers with ultra-thick epitaxy for resistance to mounting stress without loss in efficiency", Proc. SPIE 12403, High-Power Diode Laser Technology XXI, 124030J (14 March 2023); https://doi.org/10.1117/12.2647096
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KEYWORDS
Semiconductor lasers

Epitaxy

Continuous wave operation

Resistance

Near field

Near field optics

Heatsinks

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