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This study characterized the thermal conductivity (κ) values of a few commonly available fused-filament fabrication (FFF) type 3D printing materials that have the potential to be used to 3D-print interior architectural wall panels. The materials included polylactic acid (PLA), acrylonitrile butadiene styrene (ABS), and polyethylene terephthalate glycol (PETG). Three infill percentages (20, 60, and 98%) and three infill patterns (grid, zigzag, and honeycomb) were investigated in the study. The characterized thermal conductivity values revealed that these 3Dprinted material sample coupon thermal conductivity values ranged from 0.15 to 0.31 W m¯¹ K¯¹ and were comparable to gypsum plaster, drywall, and hardwood. Generally, lower infill densities (e.g., infill percentage ~20%) contributed to sample coupons with lower thermal conductivity values (e.g., κ~0.15 W m¯¹ K¯¹). Zigzag and honeycomb infill patterns generally showed lower thermal conductivity values (~30 to 60% lower κ-value) than grid-type infill patterns for a given infill density. 3D-printed sample coupons with PLA material indicated higher thermal conductivity values (~10-33% higher κ-value) when compared to ABS and PETG 3D-printed sample coupons. The study results also showed that 3D printing could fabricate components such as interior building panels with desired target thermal conductivity values. The findings also showed that by selecting the combination of 1) material, 2) infill pattern, and 3) infill percentage, constant or localized gradient thermal conductivity values could be engineered that are difficult to achieve with traditional interior building materials.
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