Study on failure behaviour of composite stiffener runout with crack stop bolts under tensile load

Ru Zhang; Fei Yu; Xinxiang Li; Xiangming Chen; Kaiyuan Zhou

doi:10.1117/12.2687177

6 August 2023 Study on failure behaviour of composite stiffener runout with crack stop bolts under tensile load

Ru Zhang, Fei Yu, Xinxiang Li, Xiangming Chen, Kaiyuan Zhou

Proceedings Volume 12781, International Conference on Optoelectronic Information and Functional Materials (OIFM 2023); 127813S (2023) https://doi.org/10.1117/12.2687177
Event: 2023 International Conference on Optoelectronic Information and Functional Materials (OIFM 2023), 2023, Guangzhou, JS, China

Abstract

The load-bearing capacity of the stiffener runout structure is significantly reduced by interface debonding due to load eccentricity and stiffness discontinuity. This study investigates that failure behavior of the stiffener runout with crack stop bolts under tension load considering the influence of debonding at the skin/stiffener interface. Finite element models of pre-disbonding between stiffener and skin interface of stiffener runout with bolts were established using the ABAQUS platform. The bolt reinforcement area was modeled using the Global Bolted Joint Model (GBJM). The effect of the prefabricated debonding area on the damage initiation and structural load carrying capacity was analyzed, and the bolt transfer loads of the structure with different prefabricated debonding areas were compared. The results demonstrate that the damage initiation load increases with the expansion of the interface debonding area, and the damage load of the structure is almost independent of the interface debonding area. Additionally, the larger the intact area of the stiffener-skin bonding interface, the smaller the total load transferred through the crack stop bolt.

Citation Download Citation

Ru Zhang, Fei Yu, Xinxiang Li, Xiangming Chen, and Kaiyuan Zhou "Study on failure behaviour of composite stiffener runout with crack stop bolts under tensile load", Proc. SPIE 12781, International Conference on Optoelectronic Information and Functional Materials (OIFM 2023), 127813S (6 August 2023); https://doi.org/10.1117/12.2687177

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