Rapid thickness and profile measurement of bonded multi-layer structures

W. Jordan Hall

doi:10.1117/12.3022748

12 March 2024 Rapid thickness and profile measurement of bonded multi-layer structures

W. Jordan Hall

Proceedings Volume 12913, Optical Architectures for Displays and Sensing in Augmented, Virtual, and Mixed Reality (AR, VR, MR) V; 1291315 (2024) https://doi.org/10.1117/12.3022748
Event: SPIE AR | VR | MR, 2024, San Francisco, California, United States

Abstract

Multi-layer bonded structures play an important role in AR/VR systems. Parallelism between layers and the consistency of thin gaps is critical for the function of these devices. Opto-Alignment has developed a system that provides rapid, non-contact measurement of these types of structures. In this presentation, we will share measurements of components from a commercially available AR headset. Thickness maps of the different layers as well as overall profile data will be presented.

Conference Presentation

(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

W. Jordan Hall "Rapid thickness and profile measurement of bonded multi-layer structures", Proc. SPIE 12913, Optical Architectures for Displays and Sensing in Augmented, Virtual, and Mixed Reality (AR, VR, MR) V, 1291315 (12 March 2024); https://doi.org/10.1117/12.3022748

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