Simulation of thermal stress on soldering surface of conduction cooling end-pumped slat laser amplifier

Lu Chen; Shengwei Bian; Lei Liu; Wentao Wang

doi:10.1117/12.3011141

18 December 2023 Simulation of thermal stress on soldering surface of conduction cooling end-pumped slat laser amplifier

Lu Chen, Shengwei Bian, Lei Liu, Wentao Wang

Author Affiliations +

Proceedings Volume 12959, AOPC 2023: Laser Technology and Applications; and Optoelectronic Devices and Integration; 129591G (2023) https://doi.org/10.1117/12.3011141
Event: Applied Optics and Photonics China 2023 (AOPC2023), 2023, Beijing, China

Abstract

This paper introduces the thermal effect of the slab amplifying module in the high-energy solid-state laser, mainly simulates the influence of the thickness of the metal indium layer on the welding surface of the slab and the heat sink on the thermal effect of the slab, and analyzes the effect of different thicknesses of the indium layer on the thermal effect of the slab. The thickness of the metal indium layer used in the calculation is 10μm, 40μm and 80μm respectively. This paper provides a powerful reference for the engineering application of high-power and high-beam-quality all-solid-state laser systems.

(2023) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Lu Chen, Shengwei Bian, Lei Liu, and Wentao Wang "Simulation of thermal stress on soldering surface of conduction cooling end-pumped slat laser amplifier", Proc. SPIE 12959, AOPC 2023: Laser Technology and Applications; and Optoelectronic Devices and Integration, 129591G (18 December 2023); https://doi.org/10.1117/12.3011141

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