Paper
6 February 2024 Interface control and preparation technology of ultrahigh thermal conductivity APG/Cu composites
Yulin Liu, Zhongnan Xie, Hong Guo, Ximin Zhang, Mingmei Sun, Shuhui Huang, Haofeng Xie
Author Affiliations +
Proceedings Volume 12979, Ninth International Conference on Energy Materials and Electrical Engineering (ICEMEE 2023); 1297902 (2024) https://doi.org/10.1117/12.3015402
Event: 9th International Conference on Energy Materials and Electrical Engineering (ICEMEE 2023), 2023, Guilin, China
Abstract
With the increase in electronic devices’ power density, the thermal runaway caused by thermal aggregation seriously affects the reliability and life of electronic devices. To diffuse the point heat source into the area heat source to reduce the heat aggregation phenomenon, a novel copper encapsulated Annealed Pyrolytic Graphite (APG) was prepared by Vacuum Hot Pressing (VHP). The influence of preparation and plating parameters on the microstructure and thermal conductivity of APG/Cu were studied. As a result, the uniform and compact Ti coating with 0.7 μm thickness was obtained by vacuum evaporation at 800 °C for 1.5 h. High thermal conductivity was obtained by the sintering process with graphite content of 50 vol.% at 870 °C/50 MPa. An ultrahigh in-plane thermal conductivity of 1243.19 W/mK for APG/Cu composites with 50 vol.% graphite content was obtained at 870 °C/50 MPa. Currently, the density of the composite exceeds 98%. Ultrahigh thermal conductivity makes APG/Cu composites a candidate material for thermal management.
(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.
Yulin Liu, Zhongnan Xie, Hong Guo, Ximin Zhang, Mingmei Sun, Shuhui Huang, and Haofeng Xie "Interface control and preparation technology of ultrahigh thermal conductivity APG/Cu composites", Proc. SPIE 12979, Ninth International Conference on Energy Materials and Electrical Engineering (ICEMEE 2023), 1297902 (6 February 2024); https://doi.org/10.1117/12.3015402
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