Paper
28 February 2024 An improved PCB defect detection algorithm for YOLOv7-tiny
Yang Yang, Qin Qiang
Author Affiliations +
Proceedings Volume 13071, International Conference on Mechatronic Engineering and Artificial Intelligence (MEAI 2023); 130712P (2024) https://doi.org/10.1117/12.3025456
Event: International Conference on Mechatronic Engineering and Artificial Intelligence (MEAI 2023), 2023, Shenyang, China
Abstract
In the manufacturing of printed circuit boards, due to production processes and other issues that can easily lead to defects in the circuit board. In order to improve the efficiency of circuit board defect detection, a defect detection algorithm for bare PCB based on improved YOLOv7-tiny is proposed. First, a new ELAN structure, New-ELAN, is proposed to replace the ELAN structure in the Head section, and the three detection heads in the Head section are reduced to two. Next, reconnecting the Neck structure and reducing the number of channels to reduce computation. The experimental results show that: under certain training conditions, the improved YOLOv7-tiny's mAP value reaches 93.9%, which is 4.8% higher than the original model. In addition, the speed and size of the improved model remain essentially the same. The improved model has better detection results.
(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.
Yang Yang and Qin Qiang "An improved PCB defect detection algorithm for YOLOv7-tiny", Proc. SPIE 13071, International Conference on Mechatronic Engineering and Artificial Intelligence (MEAI 2023), 130712P (28 February 2024); https://doi.org/10.1117/12.3025456
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KEYWORDS
Detection and tracking algorithms

Defect detection

Deep learning

Target detection

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