Integrated packaging of optical backplanes

Juergen Jahns

doi:10.1117/12.25551

1 April 1991 Integrated packaging of optical backplanes

Juergen Jahns

Proceedings Volume 1389, Microelectronic Interconnects and Packages: Optical and Electrical Technologies; (1991) https://doi.org/10.1117/12.25551
Event: Advances in Intelligent Robotics Systems, 1990, Boston, MA, United States

Abstract

An approach is described to integrate optical systems on single substrates. It uses free-space optical propagation of the light signals inside the substrate and lithographically fabricated optical elements that can be aligned and mounted with submicron precision. Two-dimensional arrays of surface-emitting laser diodes and detector arrays can be used to implement integrated-optical backplanes in electronic multiprocessor systems or all-optical computers.

Citation Download Citation

Juergen Jahns "Integrated packaging of optical backplanes", Proc. SPIE 1389, Microelectronic Interconnects and Packages: Optical and Electrical Technologies, (1 April 1991); https://doi.org/10.1117/12.25551

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