Multidisciplinary analysis and design of printed wiring boards

Robert E. Fulton; Joseph L.A. Hughes; Waymond R. Scott Jr.; Charles Umeagukwu; Chao-Pin Yeh

doi:10.1117/12.25517

1 April 1991 Multidisciplinary analysis and design of printed wiring boards

Robert E. Fulton, Joseph L.A. Hughes, Waymond R. Scott Jr., Charles Umeagukwu, Chao-Pin Yeh

Proceedings Volume 1389, Microelectronic Interconnects and Packages: Optical and Electrical Technologies; (1991) https://doi.org/10.1117/12.25517
Event: Advances in Intelligent Robotics Systems, 1990, Boston, MA, United States

Abstract

Modern printed wiring board design depends on electronic prototyping using computer-based simulation and design tools. Existing electrical computer-aided design (ECAD) tools emphasize circuit connectivity with only rudimentary analysis capabilities. This paper describes a prototype integrated PWB design environment denoted Thermal Structural Electromagnetic Testability (TSET) being developed at Georgia Tech in collaboration with companies in the electronics industry. TSET provides design guidance based on enhanced electrical and mechanical CAD capabilities including electromagnetic modeling testability analysis thermal management and solid mechanics analysis. TSET development is based on a strong analytical and theoretical science base and incorporates an integrated information framework and a common database design based on a systematic structured methodology.

Citation Download Citation

Robert E. Fulton, Joseph L.A. Hughes, Waymond R. Scott Jr., Charles Umeagukwu, and Chao-Pin Yeh "Multidisciplinary analysis and design of printed wiring boards", Proc. SPIE 1389, Microelectronic Interconnects and Packages: Optical and Electrical Technologies, (1 April 1991); https://doi.org/10.1117/12.25517

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