Computer-Aided System Interconnect Design (CASID) in multipackage environment

N. S. Chandrasehekaran; V. Sundari; Jacob V. Vengal; P. N. A. P. Rao

doi:10.1117/12.25606

1 April 1991 Computer-Aided System Interconnect Design (CASID) in multipackage environment

N. S. Chandrasehekaran, V. Sundari, Jacob V. Vengal, P. N. A. P. Rao

Proceedings Volume 1390, Microelectronic Interconnects and Packages: System and Process Integration; (1991) https://doi.org/10.1117/12.25606
Event: Advances in Intelligent Robotics Systems, 1990, Boston, MA, United States

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N. S. Chandrasehekaran, V. Sundari, Jacob V. Vengal, and P. N. A. P. Rao "Computer-Aided System Interconnect Design (CASID) in multipackage environment", Proc. SPIE 1390, Microelectronic Interconnects and Packages: System and Process Integration, (1 April 1991); https://doi.org/10.1117/12.25606

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