Holographic optical interconnects for multichip modules

Michael R. Feldman

doi:10.1117/12.25598

1 April 1991 Holographic optical interconnects for multichip modules

Michael R. Feldman

Proceedings Volume 1390, Microelectronic Interconnects and Packages: System and Process Integration; (1991) https://doi.org/10.1117/12.25598
Event: Advances in Intelligent Robotics Systems, 1990, Boston, MA, United States

Abstract

An optically interconnected multichip module designed specifically to meet the demands of high performance processor array systems is proposed. The system consists of computer generated holograms GaAs laser array chips and Si VLSI chips containing processing elements and integrated photodetectors. All components are incorporated into a package (similar to an existing multichip module design) with a water-cooled heat sink. All intramodule chip-to-chip connections longer than a particular line length and all intermodule connections are implemented optically. Limitations on power dissipation bandwidth connection density and alignment tolerances are discussed. The performance is compared with both electrical thin film interconnects and guided wave optical interconnects.

Citation Download Citation

Michael R. Feldman "Holographic optical interconnects for multichip modules", Proc. SPIE 1390, Microelectronic Interconnects and Packages: System and Process Integration, (1 April 1991); https://doi.org/10.1117/12.25598

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