Glass requirements for encapsulating metallurgical diodes

Mir Akbar Ali; Gerald L. Meldrum; Jeffry M. Krieger

doi:10.1117/12.46026

1 August 1991 Glass requirements for encapsulating metallurgical diodes

Mir Akbar Ali, Gerald L. Meldrum, Jeffry M. Krieger

Proceedings Volume 1513, Glasses for Optoelectronics II; (1991) https://doi.org/10.1117/12.46026
Event: ECO4 (The Hague '91), 1991, The Hague, Netherlands

Abstract

Environmental temperature variations cause stresses to develop in structures that contain materials with different coefficients of thermal expansion. Such a condition often exists in glass encapsulated diodes used in the electronic systems. The situation is further aggravated by the metallurgy of the diodes in the form of stresses due to corrosion--the stress corrosion effect. A third factor that introduces stresses in the encapsulated diodes is due to the design of the glass encapsulation. A combination of these factors led to a failure of glass encapsulated diodes and were identified in a recent study conducted at the Technology Support Division (TSD), Electro-Optical and Data Systems Group of Hughes Aircraft Company. A judicious selection of the encapsulating glasses, its properties, and the design of the seal becomes an important factor in the fabrication of a hermetically sealed diode. This paper highlights such failure mechanisms and describes the desirable properties and design requirements of sealing glasses used for encapsulating the diodes.

Citation Download Citation

Mir Akbar Ali, Gerald L. Meldrum, and Jeffry M. Krieger "Glass requirements for encapsulating metallurgical diodes", Proc. SPIE 1513, Glasses for Optoelectronics II, (1 August 1991); https://doi.org/10.1117/12.46026

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