Protection of aluminum alloy films from after corrosion using H2O down stream ashing

Fukashi Harada; T. Kondo; J. Konno; Shuzo Fujimura; K. Shinagawa; T. Takada

doi:10.1117/12.56930

1 February 1992 Protection of aluminum alloy films from after corrosion using H2_O down stream ashing

Fukashi Harada, T. Kondo, J. Konno, Shuzo Fujimura, K. Shinagawa, T. Takada

Proceedings Volume 1593, Dry Etch Technology; (1992) https://doi.org/10.1117/12.56930
Event: Microelectronic Processing Integration, 1991, San Jose, CA, United States

Abstract

While miniatuarization of semiconductors has enabled aluminum wiring pattern dimensions smaller and smaller, this has also given rise to problems such as stress migration and electromigration. The use of copper reportedly suppreses such migration.

Citation Download Citation

Fukashi Harada, T. Kondo, J. Konno, Shuzo Fujimura, K. Shinagawa, and T. Takada "Protection of aluminum alloy films from after corrosion using H2_O down stream ashing", Proc. SPIE 1593, Dry Etch Technology, (1 February 1992); https://doi.org/10.1117/12.56930

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