Thermal design methodology of hot and chill plates for photolithography

David P. DeWitt; T. C. Niemoeller; Chris A. Mack; Gil Yetter

doi:10.1117/12.174144

1 May 1994 Thermal design methodology of hot and chill plates for photolithography

David P. DeWitt, T. C. Niemoeller, Chris A. Mack, Gil Yetter

Proceedings Volume 2196, Integrated Circuit Metrology, Inspection, and Process Control VIII; (1994) https://doi.org/10.1117/12.174144
Event: SPIE's 1994 Symposium on Microlithography, 1994, San Jose, CA, United States

Abstract

The major requirement for hot- and chill-plate designs is that they provide repeatable and uniform process conditions thereby assuring consistent photoresist quality. A collection of feature-based thermal models has been developed to predict temperature-time histories considering plate construction features including chuck heating/cooling methods, sensor placement with a PID control algorithm, and effects due to vacuum grooves, access holes, support pins and edge-gap. These models can be used by designers and process technologists to assess new approaches, optimize current design and set performance specifications.

Citation Download Citation

David P. DeWitt, T. C. Niemoeller, Chris A. Mack, and Gil Yetter "Thermal design methodology of hot and chill plates for photolithography", Proc. SPIE 2196, Integrated Circuit Metrology, Inspection, and Process Control VIII, (1 May 1994); https://doi.org/10.1117/12.174144

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