Holographic interconnects for 3D processors

Robert L. Kaminski; Freddie Shing-Hong Lin; Cong T. Nguyen; Robert M. Mino; Peterlynn R. Bumacod

doi:10.1117/12.179125

29 June 1994 Holographic interconnects for 3D processors

Robert L. Kaminski, Freddie Shing-Hong Lin, Cong T. Nguyen, Robert M. Mino, Peterlynn R. Bumacod

Proceedings Volume 2240, Advances in Optical Information Processing VI; (1994) https://doi.org/10.1117/12.179125
Event: SPIE's International Symposium on Optical Engineering and Photonics in Aerospace Sensing, 1994, Orlando, FL, United States

Abstract

This paper reviews two demonstration hardware devices built to show the advantages and potential of holographic optical interconnect techniques for use in a 3D optoelectronic computer architecture.

Citation Download Citation

Robert L. Kaminski, Freddie Shing-Hong Lin, Cong T. Nguyen, Robert M. Mino, and Peterlynn R. Bumacod "Holographic interconnects for 3D processors", Proc. SPIE 2240, Advances in Optical Information Processing VI, (29 June 1994); https://doi.org/10.1117/12.179125

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