Three-dimensional sensor readout electronics using conventional detector hybrid assemblies

William B. Hornback

doi:10.1117/12.243539

26 June 1996 Three-dimensional sensor readout electronics using conventional detector hybrid assemblies

William B. Hornback

Proceedings Volume 2745, Infrared Readout Electronics III; (1996) https://doi.org/10.1117/12.243539
Event: Aerospace/Defense Sensing and Controls, 1996, Orlando, FL, United States

Abstract

Pressures to increase resolution, achieve compact packages, and lower costs continue to drive focal plane readout circuits to highly complex designs with lowered yields in cutting edge processes. By designing a set of signal processing electronics into a 3D structure, cost and performance goals can be met while using higher yielding readouts and existing focal plane hybrids. The approach described in this paper allows existing designs from 480 X 4 through 480 X 640 to be used in compact sensor designs in a wide variety of applications. The demonstration of the approach uses an existing InSb photovoltaic hybrid array in a 120 X 160 configuration. Functions for non- uniformity correction, memory, and analog-to-digital conversion have been incorporated into a structure compatible with conventional dewar assemblies for military and commercial applications. The technology for these 3D focal planes is applicable to sensor functions for non- uniformity correction, analog-to-digital conversion, spatial and temporal filtering, fovea vision, event-driven multiplexing, data compression and coding, and pattern recognition.

Citation Download Citation

William B. Hornback "Three-dimensional sensor readout electronics using conventional detector hybrid assemblies", Proc. SPIE 2745, Infrared Readout Electronics III, (26 June 1996); https://doi.org/10.1117/12.243539

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