Microcomposite electroforming for MEMS technology

Shinn-Horng Yeh; Chun-Ying Liue; Ji-Weng Wang; Min-Chieh Chou; Shu-Ling Hou

doi:10.1117/12.284468

5 September 1997 Microcomposite electroforming for MEMS technology

Shinn-Horng Yeh, Chun-Ying Liue, Ji-Weng Wang, Min-Chieh Chou, Shu-Ling Hou

Proceedings Volume 3223, Micromachining and Microfabrication Process Technology III; (1997) https://doi.org/10.1117/12.284468
Event: Micromachining and Microfabrication, 1997, Austin, TX, United States

Abstract

Composite electroforming is an electroplating technique basically. The ceramic or other type powder is mixed into electroforming solution, then codeposited with metal ion by using electroplating method. The codeposit is strengthen by the ceramic powder, which can be used for the application in MEMS field. We do the microcomposite electroforming research by using ultrafine (submicron or nano-sized) powder. The 20g/L silicon carbide powder added to nickel sulfamate electroforming solution can obtain the higher hardness and internal stress deposits (1.5 wt% SiC). Because high internal stress is harmful for electroforming process, it's necessary to take a suitable electrolyte and controlled condition for high hardness and low internal stress in microcomposite electroforming process.

Citation Download Citation

Shinn-Horng Yeh, Chun-Ying Liue, Ji-Weng Wang, Min-Chieh Chou, and Shu-Ling Hou "Microcomposite electroforming for MEMS technology", Proc. SPIE 3223, Micromachining and Microfabrication Process Technology III, (5 September 1997); https://doi.org/10.1117/12.284468

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