Paper
14 November 1997 DC magnetron-sputtered molybdenum thin films for micromechanical structures
Chee Yee Kwok, Tom Puzzer, Kwang Ming Lin, Jafar Haji-Babaei
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Proceedings Volume 3241, Smart Materials, Structures, and Integrated Systems; (1997) https://doi.org/10.1117/12.293487
Event: Far East and Pacific Rim Symposium on Smart Materials, Structures, and MEMS, 1997, Adelaide, Australia
Abstract
The suitability of refractory metal, molybdenum, as a material for microstructures in MEMS is explored in this paper. This paper describes the effects of dc magnetron sputtering conditions on the residual stress of the film. The effects of post deposition annealing as a means of stress relief are also reported. Post deposition annealing also addresses the problems of film adhesion. An example of the application of Mo is given in the form of a cantilever structure suspended over a silicon gap which involves both surface and bulk micromachining.
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Chee Yee Kwok, Tom Puzzer, Kwang Ming Lin, and Jafar Haji-Babaei "DC magnetron-sputtered molybdenum thin films for micromechanical structures", Proc. SPIE 3241, Smart Materials, Structures, and Integrated Systems, (14 November 1997); https://doi.org/10.1117/12.293487
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KEYWORDS
Molybdenum

Silicon

Annealing

Bulk micromachining

Semiconducting wafers

Thin films

Etching

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