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A novel plasma-activated CVD process has been employed to deposit SiO2 and mixed oxide (SiO2+ Al2O3) covers directly on silicon solar cells. SiO2 covers as thick as 130μm were deposited near 20μm per hour at substrate temperatures below 150°C. Deposition stresses and cell fracture become serious problems above 60μm thickness.
Harold S. Gurev
"Fabrication Of Integral Solar Cell Covers By A Plasma-Activated Source", Proc. SPIE 0325, Optical Thin Films, (29 April 1982); https://doi.org/10.1117/12.933296
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Harold S. Gurev, "Fabrication Of Integral Solar Cell Covers By A Plasma-Activated Source," Proc. SPIE 0325, Optical Thin Films, (29 April 1982); https://doi.org/10.1117/12.933296