Planarization of metallic parts for single- and multilevel (S)LIGA

Chantal G. Khan Malek; Robert L. Wood; Perry Genova

doi:10.1117/12.320158

20 July 1998 Planarization of metallic parts for single- and multilevel (S)LIGA

Chantal G. Khan Malek, Robert L. Wood, Perry Genova

Proceedings Volume 3328, Smart Structures and Materials 1998: Smart Electronics and MEMS; (1998) https://doi.org/10.1117/12.320158
Event: 5th Annual International Symposium on Smart Structures and Materials, 1998, San Diego, CA, United States

Abstract

The quality of surface finish and precise height of LIGA components produced by electroplating has been studied. Planarization is often required to meet specifications for both basic LIGA processing (single level) and extended LIGA processing (multi-level). The HI-MEMS Alliance has successfully developed such a planarization process.

Citation Download Citation

Chantal G. Khan Malek, Robert L. Wood, and Perry Genova "Planarization of metallic parts for single- and multilevel (S)LIGA", Proc. SPIE 3328, Smart Structures and Materials 1998: Smart Electronics and MEMS, (20 July 1998); https://doi.org/10.1117/12.320158

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