Paper
29 September 1998 Combined measurement of silicon microbeams by grating interferometry and digital holography
Author Affiliations +
Proceedings Volume 3407, International Conference on Applied Optical Metrology; (1998) https://doi.org/10.1117/12.323338
Event: International Conference on Applied Optical Metrology, 1998, Balatonfured, Hungary
Abstract
In this paper the methodology and instrumentation for the investigation of the silicon microbeam behavior under tensile and bending loads are described. The tests are performed by means of Automated Grating Interferometry (AGI) and Digital Holography (DH). Both methods deliver a direct approach to a highly sensitive measurement of surface displacements. In combination with simulation tools (analytical or FEM models) the material parameters can be determined. Consequently the main aim of the measurements is to determine the three Cartesian components of the displacement vector.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Werner P. O. Jueptner, Malgorzata Kujawinska, Wolfgang Osten, Leszek A. Salbut, and Soenke Seebacher "Combined measurement of silicon microbeams by grating interferometry and digital holography", Proc. SPIE 3407, International Conference on Applied Optical Metrology, (29 September 1998); https://doi.org/10.1117/12.323338
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Cited by 21 scholarly publications.
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KEYWORDS
Silicon

Digital holography

Interferometry

Interferometers

Photoresist materials

Holography

Semiconducting wafers

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