Micromachined structure for Si transmission optical components

Minoru Sasaki; Yuji Arai; Hitoshi Takebe; Wataru Kamada; Kazuhiro Hane

doi:10.1117/12.324286

2 September 1998 Micromachined structure for Si transmission optical components

Minoru Sasaki, Yuji Arai, Hitoshi Takebe, Wataru Kamada, Kazuhiro Hane

Proceedings Volume 3513, Microelectronic Structures and MEMS for Optical Processing IV; (1998) https://doi.org/10.1117/12.324286
Event: Micromachining and Microfabrication, 1998, Santa Clara, CA, United States

Abstract

Recent progress of the deep reactive ion etching explores several new applications of 3D structures of silicon devices. We have developed new optical and electrical devices having the penetrating holes to transmit the optical beam to the down stream. The transmission silicon position sensor having the divided cell type photodiode on the Si mesh structure is fabricated. The beam splitter is considered to be integrated in this device and a part of the incident light beam is detected by the photodiode. Using nearly same technique, the pinhole of the spatial filter surrounded by the divided cell type photodiode is fabricated to detect the relative position between the incident beam spot and the center pinhole.

Citation Download Citation

Minoru Sasaki, Yuji Arai, Hitoshi Takebe, Wataru Kamada, and Kazuhiro Hane "Micromachined structure for Si transmission optical components", Proc. SPIE 3513, Microelectronic Structures and MEMS for Optical Processing IV, (2 September 1998); https://doi.org/10.1117/12.324286

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