Self-aligned polysilicon MEMS-reduced mask count surface micromachining

J. Mark Noworolski; Seth R. Sanders

doi:10.1117/12.323904

8 September 1998 Self-aligned polysilicon MEMS-reduced mask count surface micromachining

J. Mark Noworolski, Seth R. Sanders

Proceedings Volume 3514, Micromachined Devices and Components IV; (1998) https://doi.org/10.1117/12.323904
Event: Micromachining and Microfabrication, 1998, Santa Clara, CA, United States

Abstract

A self-aligned reduced mask count micromachined polysilicon on nitride (SAMPSON) surface micromachining process is introduced. The self-alignment fabrication concept enables rapid fabrication, improves yields, and reduces parasitic capacitance of MEM devices. For many MEM devices the SAMPSON process results in a one mask savings over more conventional approaches. As a demonstration of the fabrication technique a burst-proof surface micromachined polysilicon resonant pressure sensor is fabricated using the SAMPSON process. This pressure sensor does not require a sealed cavity. It is also insensitive to mechanical property variations of the structural material, rendering its response essentially temperature independent.

Citation Download Citation

J. Mark Noworolski and Seth R. Sanders "Self-aligned polysilicon MEMS-reduced mask count surface micromachining", Proc. SPIE 3514, Micromachined Devices and Components IV, (8 September 1998); https://doi.org/10.1117/12.323904

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