Wafer scale integration of micro-optic and optoelectronic elements by polymer UV reaction molding

Peter Dannberg; Ralf Bierbaum; Lars Erdmann; Andreas H. Braeuer

doi:10.1117/12.348319

30 April 1999 Wafer scale integration of micro-optic and optoelectronic elements by polymer UV reaction molding

Peter Dannberg, Ralf Bierbaum, Lars Erdmann, Andreas H. Braeuer

Proceedings Volume 3631, Optoelectronic Integrated Circuits and Packaging III; (1999) https://doi.org/10.1117/12.348319
Event: Optoelectronics '99 - Integrated Optoelectronic Devices, 1999, San Jose, CA, United States

Abstract

A replication technique allowing for the wafer scale integration of microoptical elements is presented and illustrated by various examples. The technique is based on polymer UV reaction moulding using a modified contact mask aligned where mask and wafer are replaced by the replication tool and an arbitrary substrate, respectively. The technology takes advantage of the high precision and adjustment accuracy of photolithography equipment. The replication masters are nickel shims, etched Silicon wafers or uv-transparent fused silica tools. The latter ones allow for replication on opaque substrates. Additionally, polymer elements with unique properties can be obtained by the combination of replication and resist technology using partially transparent replication tools. Wafer scale hybrid integration of microoptical subsystems is accomplished by replication of polymer elements like lenses, lens arrays, micro prisms etc. onto semiconductor wafers containing detectors or VCSELs, or by combining microoptical elements on both sides of a glass wafer. The use of thin layers of uv cured polymers on inorganic substrates results in good thermal and mechanical stability compare to all-polymer devices.

Citation Download Citation

Peter Dannberg, Ralf Bierbaum, Lars Erdmann, and Andreas H. Braeuer "Wafer scale integration of micro-optic and optoelectronic elements by polymer UV reaction molding", Proc. SPIE 3631, Optoelectronic Integrated Circuits and Packaging III, (30 April 1999); https://doi.org/10.1117/12.348319

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