Paper
30 August 1999 Resolution enhancement techniques for submicron deep trench processes
Lijun Tong, Joyce Hsiang, Kuanchih Lin, Gary Newman
Author Affiliations +
Proceedings Volume 3874, Micromachining and Microfabrication Process Technology V; (1999) https://doi.org/10.1117/12.361233
Event: Symposium on Micromachining and Microfabrication, 1999, Santa Clara, CA, United States
Abstract
Due to the rapid advancements in the data storage market, the development of new technologies and mechanisms are needed to support the continued growth of data storage systems. The concept and technology of Micro Electro Mechanical Systems (MEMS) can provide opportunities to meet these demands. Correspondingly, new MEMS devices can be made commercially available by sharing the benefits of developments in data storage systems. The photolithography requirements for thin film head (TFH) processing have grown increasingly challenging. Specifically, the resolution of submicron isolated features is required in thick photoresist; resulting in aspect ratios of nearly 10 to 1. To satisfy these imaging requirements, the use of i-line reduction lithography tools with variable numerical aperture and partial coherence are necessary. This study examines the influence of NA, (sigma) , and reticle bias on critical features in a typical TFH write-layer process. Combinations of NA and (sigma) were investigated for their impact on minimum feature size, process latitude, and sidewall angle. Process latitude was quantified for each illumination condition over a range of focus and exposure conditions.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Lijun Tong, Joyce Hsiang, Kuanchih Lin, and Gary Newman "Resolution enhancement techniques for submicron deep trench processes", Proc. SPIE 3874, Micromachining and Microfabrication Process Technology V, (30 August 1999); https://doi.org/10.1117/12.361233
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KEYWORDS
Head

Data storage

Magnetism

Photoresist materials

Microelectromechanical systems

Lithography

Thin films

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