Characterization of the CMP process by atomic force profilometry

Larry M. Ge; Dean J. Dawson

doi:10.1117/12.361298

3 September 1999 Characterization of the CMP process by atomic force profilometry

Larry M. Ge, Dean J. Dawson

Proceedings Volume 3882, Process, Equipment, and Materials Control in Integrated Circuit Manufacturing V; (1999) https://doi.org/10.1117/12.361298
Event: Microelectronic Manufacturing '99, 1999, Santa Clara, CA, United States

Abstract

We demonstrate the measurement capabilities of the newly developed Atomic Force Profiler (AFP) as a CMP process metrology tool. AFP combines a TappingMode atomic force microscopy (AFM) with a long scan profiler stage and can be used to characterize post-CMP local and global planarization for current and future generations of device manufacturing. The AFP enables CMP measurements of dishing, erosion, plug recess, and surface texture, providing adequate lateral resolution to image individual deep sub-micron device features as well as capability to profile long scans across multiple dies. In this paper we demonstrate that AFP can be used for the process development and production monitoring of metal CMP. Automated measurement of deep sub-micron W plug recess/protrusion, damascene Cu lines recess/protrusion, as well as erosion due to W or Cu structures is presented.

Citation Download Citation

Larry M. Ge and Dean J. Dawson "Characterization of the CMP process by atomic force profilometry", Proc. SPIE 3882, Process, Equipment, and Materials Control in Integrated Circuit Manufacturing V, (3 September 1999); https://doi.org/10.1117/12.361298

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