Paper
7 February 2000 Microstructuring of glass with excimer laser radiation at different processing gas atmospheres for microreaction technology
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Proceedings Volume 3888, High-Power Lasers in Manufacturing; (2000) https://doi.org/10.1117/12.377030
Event: Advanced High-Power Lasers and Applications, 1999, Osaka, Japan
Abstract
Microstructuring of soda lime glass with excimer laser radiation is examined to present its process capabilities for production of surface structures particularly for microreaction technology. Material removal rates, geometries of microstructures and transmission/reflexion of processed soda lime glass are investigated for ArF excimer laser radiation ((lambda) L equals 193 nm, (tau) L equals 20 ns) and KrF excimer laser radiation ((lambda) L equals 248 nm, (tau) L equals 25 ns). Processing of glass at atmospheric pressure down to vacuum at p equals .10 mbar (He as processing gas) is carried out to investigate the correlation between processing gas pressure and generation of debris (solidification of molten material and re-deposition from expanding vapor/plasma). The influence of processing gas atmospheres consisting of He/F2 (50/50 vol.%) with a total pressure in the vacuum chamber of 10 mbar less than p less than 250 mbar on height/width of the debris is examined. Ultrasonic cleaning of glass after processing is investigated for reduction of debris. Optical microscopy, white light interferometry, optical spectroscopy and X-ray photoelectron spectroscopy (XPS) are used for analysis of microstructures and debris.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Michael Jacquorie, Ernst-Wolfgang Kreutz, and Reinhart Poprawe "Microstructuring of glass with excimer laser radiation at different processing gas atmospheres for microreaction technology", Proc. SPIE 3888, High-Power Lasers in Manufacturing, (7 February 2000); https://doi.org/10.1117/12.377030
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KEYWORDS
Glasses

Excimer lasers

Absorption

Atmospheric particles

Ultrasonics

Color centers

Laser processing

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