Microphotoluminescence mapping of packaging-induced stress distribution in high-power AlGaAs laser diodes

Pilar Martin; Jean-Pierre Landesman; Esther Martin; A. Fily; Jean-Pierre Hirtz; Renato Bisaro

doi:10.1117/12.380548

29 March 2000 Microphotoluminescence mapping of packaging-induced stress distribution in high-power AlGaAs laser diodes

Pilar Martin, Jean-Pierre Landesman, Esther Martin, A. Fily, Jean-Pierre Hirtz, Renato Bisaro

Proceedings Volume 3945, Laser Diodes and LEDs in Industrial, Measurement, Imaging, and Sensors Applications II; Testing, Packaging, and Reliability of Semiconductor Lasers V; (2000) https://doi.org/10.1117/12.380548
Event: Symposium on Integrated Optoelectronics, 2000, San Jose, CA, United States

Abstract

Spatially resolved photo-luminescence (PL) line-scans were performed in a specific optical micro-probe to determine the soldering-induced local stresses in GaAs/GaAlAs laser diode arrays designed for high-power operation at 808 nm. In this approach, the sign and magnitude of the local stress are deduced from the spectral shift associated with band-to-band transitions in the GaAs substrate. The sensitivity (minimal equivalent hydrostatic stress that can be detected) is better than 10 MPa. The spatial resolution of the micro-PL technique (of the order of 1 micrometer), together with the short acquisition times, allows for detailed investigations of the stress profiles along the whole laser bars with a large number of data points. Different aspects of the mechanical stress distribution at the various steps of the process could thus be revealed. Finally, correlations between solder-induced stress distribution and estimated lifetimes were established. In particular, << V-shaped >> defects, which are known as a failure mechanism on this type of devices, were observed only on the laser bars for which the micro-PL indicates the strongest compressive stress. This leads to consider the micro-PL approach proposed here as a cost- effective screening technique for the high-power GaAs/GaAlAs laser diode arrays.

Citation Download Citation

Pilar Martin, Jean-Pierre Landesman, Esther Martin, A. Fily, Jean-Pierre Hirtz, and Renato Bisaro "Microphotoluminescence mapping of packaging-induced stress distribution in high-power AlGaAs laser diodes", Proc. SPIE 3945, Laser Diodes and LEDs in Industrial, Measurement, Imaging, and Sensors Applications II; Testing, Packaging, and Reliability of Semiconductor Lasers V, (29 March 2000); https://doi.org/10.1117/12.380548

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