Paper
10 April 2000 Computational framework for modeling one-dimensional subgrid components and phenomena in multidimensional microsystems
Maciej Z. Pindera, Sami Bayyuk, Vasudeva Upadhya, Andrzej J. Przekwas
Author Affiliations +
Proceedings Volume 4019, Design, Test, Integration, and Packaging of MEMS/MOEMS; (2000) https://doi.org/10.1117/12.382311
Event: Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, 2000, Paris, France
Abstract
This paper presents a framework for modeling essentially 1D devices and components embedded in multi-dimensional spaces. The main characteristic and main advantage of the new methodology is that the 1D and multi-dimensional objects or domain are meshed completely independently of each other, without regard to their relative alignment or location, and subsequently combined into a single, unified composite mesh. The coupling of the solution between the different domains is handled fully-automatically in the solver, entirely through exchange of source terms between these domains of differing dimensionality. The source terms are evaluated locally on a cell-by-cell basis, depending on the solution values in these domains and the manner in which the 1D grids intersect the multi-dimensional grids. The capabilities and usefulness of the method are demonstrated with several examples.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Maciej Z. Pindera, Sami Bayyuk, Vasudeva Upadhya, and Andrzej J. Przekwas "Computational framework for modeling one-dimensional subgrid components and phenomena in multidimensional microsystems", Proc. SPIE 4019, Design, Test, Integration, and Packaging of MEMS/MOEMS, (10 April 2000); https://doi.org/10.1117/12.382311
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CITATIONS
Cited by 5 scholarly publications.
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KEYWORDS
Microfluidics

Microsystems

Algorithm development

Chemical elements

Resistance

Systems modeling

Instrument modeling

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