Femtosecond laser micromachining of technical materials

Joern Bonse; Steffen Baudach; Joerg Krueger; Wolfgang Kautek

doi:10.1117/12.407346

16 August 2000 Femtosecond laser micromachining of technical materials

Joern Bonse, Steffen Baudach, Joerg Krueger, Wolfgang Kautek

Proceedings Volume 4065, High-Power Laser Ablation III; (2000) https://doi.org/10.1117/12.407346
Event: High-Power Laser Ablation, 2000, Santa Fe, NM, United States

Abstract

Micromachining experiments were performed with Ti:sapphire laser pulses (130 fs - 150 fs, 800 nm, approximately 10 Hz) in air. Employing the direct focusing technique, highly absorbing titanium nitride (TiN) and weakly absorbing polyimide (PI) and polymethylmethacrylate (PMMA) served as target materials. The lateral and vertical precision of the laser ablation and morphological features were characterized by scanning force (SFM), scanning electron (SEM) and optical microscopy. For TiN, incubation can be observed, i.e. the single-pulse surface damage threshold (0.26 J/cm²) is by a factor of two greater than the threshold for 100 pulses. Ablation rates below 10 nm per pulse can be achieved. The evolution of sub-wavelength ripples is presented in dependence on pulse number and laser fluence, respectively. The incubation behavior of the polymers can be described by an accumulation model as for TiN. Experiments on PI with varying focal lengths result in the same modification thresholds. Different polarization states of light (linear, circular) lead to a variation of the ablation rate and to various morphological patterns in the ablation craters (wavelength ripples, cones). Swelling of PMMA occurred at fluences below the ablation threshold.

Citation Download Citation

Joern Bonse, Steffen Baudach, Joerg Krueger, and Wolfgang Kautek "Femtosecond laser micromachining of technical materials", Proc. SPIE 4065, High-Power Laser Ablation III, (16 August 2000); https://doi.org/10.1117/12.407346

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