Large-area MEMS fabrication with thick SU-8 photoresist applied to an x-ray image sensor array

Jurgen H. Daniel; Brent S. Krusor; Raj B. Apte; Robert A. Street; Adela Goredema; Jason McCallum; Daniele C. Boils-Boissier; Peter M. Kazmaier

doi:10.1117/12.396431

25 August 2000 Large-area MEMS fabrication with thick SU-8 photoresist applied to an x-ray image sensor array

Jurgen H. Daniel, Brent S. Krusor, Raj B. Apte, Robert A. Street, Adela Goredema, Jason McCallum, Daniele C. Boils-Boissier, Peter M. Kazmaier

Author Affiliations +

Proceedings Volume 4174, Micromachining and Microfabrication Process Technology VI; (2000) https://doi.org/10.1117/12.396431
Event: Micromachining and Microfabrication, 2000, Santa Clara, CA, United States

Abstract

MEMS fabrication on large area substrates is promising for novel system concepts, but processes based on crystalline silicon cannot be used. Polymeric materials such as the thick photoresist SU-8 are more appropriate for this purpose because their processing can be scaled to large areas. An x- ray image sensor array based on amorphous silicon on glass substrates was taken as an examples to apply the SU-8 microfabrication technique. We anticipate an improved performance of the imager. The resolution of the x-ray imager is expected to increase by patterning the x-ray conversion screen into cells, which match the sensor pixels of the imager, and SU-8 defines these cells. Furthermore, SU-8 functions as a thick interlayer dielectric with decrease the electronic noise and result in a higher sensitivity of the imager. The fabrication process with SU-8 will be described and challenging issues, especially when considering large area substrates, will be discussed.

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Jurgen H. Daniel, Brent S. Krusor, Raj B. Apte, Robert A. Street, Adela Goredema, Jason McCallum, Daniele C. Boils-Boissier, and Peter M. Kazmaier "Large-area MEMS fabrication with thick SU-8 photoresist applied to an x-ray image sensor array", Proc. SPIE 4174, Micromachining and Microfabrication Process Technology VI, (25 August 2000); https://doi.org/10.1117/12.396431

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