Paper
25 August 2000 Repair of stiction-failed surface-micromachined polycrystalline silicon cantilevers using pulsed lasers
Leslie M. Phinney, James W. Rogers
Author Affiliations +
Proceedings Volume 4174, Micromachining and Microfabrication Process Technology VI; (2000) https://doi.org/10.1117/12.396443
Event: Micromachining and Microfabrication, 2000, Santa Clara, CA, United States
Abstract
A technique for repairing stiction-failed, surface- micromachined polycrystalline silicon cantilevers using pulsed lasers has been developed and demonstrated. Microcantilevers, which adhered to the substrate during the chemical sacrificial layer etch and drying processes, were irradiated with either a 800 nm Ti:sapphire or a 1064 nm Nd:YAG laser and successfully freed from the substrate. The feasibility of the laser process was first shown with a Ti:sapphire laser system irradiating undoped, polycrystalline silicon microcantilevers. The repair yields for the Nd:YAG laser process were up to 100 percent for 10 micrometers wide beams as long as 1 mm for laser fluences of 70 mJ/cm2. The sample age and initial release quality affect the laser process yield, with newer samples and those with high quality initial releases having the highest number of microcantilevers being repaired.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Leslie M. Phinney and James W. Rogers "Repair of stiction-failed surface-micromachined polycrystalline silicon cantilevers using pulsed lasers", Proc. SPIE 4174, Micromachining and Microfabrication Process Technology VI, (25 August 2000); https://doi.org/10.1117/12.396443
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Cited by 2 scholarly publications.
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KEYWORDS
Semiconductor lasers

Silicon

Pulsed laser operation

Laser processing

Laser development

Nd:YAG lasers

Etching

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