Paper
29 June 2001 F2 lasers: high-resolution optical processing system for shaping photonic components
Peter R. Herman, Kevin P. Chen, Xiaoli Midori Wei, Jie Zhang, Juergen Ihlemann, Dirk Schaefer, Gerd Marowsky, Peter Oesterlin, Berthold Burghardt
Author Affiliations +
Abstract
A high-resolution 157-nm optical system has been developed for the first time to microprocess optical materials with record short-wavelength F2-laser radiation. The F2-laser photons drive strong material interactions in silica glasses for microsculpting surfaces and for imprinting internal refractive index structures. The high-resolution optics deliver a homogenized beam of high on-target fluence (approximately 2.5 J/cm2) for ablation of fused silica and other wide bandgap optical materials. The system resolution is approaching 1-micron lateral and less than 100-nm depth - sub-wavelength features appropriate for defining optical communication components at 1.55-micrometers wavelength. This paper describes this novel processing system and offers prospects for F2-laser microfabrication and trimming of photonic components in the telecommunication and general optics manufacturing fields.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Peter R. Herman, Kevin P. Chen, Xiaoli Midori Wei, Jie Zhang, Juergen Ihlemann, Dirk Schaefer, Gerd Marowsky, Peter Oesterlin, and Berthold Burghardt "F2 lasers: high-resolution optical processing system for shaping photonic components", Proc. SPIE 4274, Laser Applications in Microelectronic and Optoelectronic Manufacturing VI, (29 June 2001); https://doi.org/10.1117/12.432547
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Cited by 15 scholarly publications.
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KEYWORDS
Glasses

Silica

Optical signal processing

Refractive index

Laser ablation

Laser processing

Optical fibers

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