Paper
29 June 2001 High-resolution 157-nm laser micromachining of polymers
Philipp Gruenewald, Julian S. Cashmore, Jim Fieret, Malcolm C. Gower
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Abstract
An Exitech Microstepper exposure tool has been used to laser micromachine a variety of polymeric materials with high resolution at a wavelength of 157 nm. We have demonstrated it is possible to machine thin film materials, different photoresists and fluorine-based polymers with submicron accuracy and resolution. The tool used for this work incorporated a 36x 0.5 NA Schwarzschild lens to project submicron resolution images of binary chrome-on-CaF2 masks onto free-standing and spun-on polymer films. The beam delivery system and the illuminator includes beam shaping and homogenization optics that allow fluences of greater than 1J/cm2 to be produced at the workpiece. Details of the optical system are presented together with process parameters and the results of the materials which have been machined.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Philipp Gruenewald, Julian S. Cashmore, Jim Fieret, and Malcolm C. Gower "High-resolution 157-nm laser micromachining of polymers", Proc. SPIE 4274, Laser Applications in Microelectronic and Optoelectronic Manufacturing VI, (29 June 2001); https://doi.org/10.1117/12.432548
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CITATIONS
Cited by 3 scholarly publications.
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KEYWORDS
Polymers

Photoresist materials

Micromachining

Mirrors

Excimer lasers

Etching

Manufacturing

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