Measuring toughness of copper-bismaleimide traizine interface by peel test

Ngan Yeow Goh; L. Cheng

doi:10.1117/12.429586

13 June 2001 Measuring toughness of copper-bismaleimide traizine interface by peel test

Ngan Yeow Goh, L. Cheng

Proceedings Volume 4317, Second International Conference on Experimental Mechanics; (2001) https://doi.org/10.1117/12.429586
Event: Second International Conference on Experimental Mechanics, 2000, Singapore, Singapore

Abstract

In this paper, the toughness of copper-bismaleimide traizine interface is determined using the peel test. Invoking energy balance and using the peel force and the extension of het strip, the total work per unit area of fractured interface is calculated. The analysis takes into consideration the elastic energy stored in the peel arm and the plastic deformations due to stretching and bending of the peel arm. Several tests were conducted under ambient conditions. Test were also performed on samples that had been precondition at 85 degrees C and 85 percent relative humidity. Results from both sets of tests showed that the interfacial toughness was in the range of 320 to 420 J/m².

Citation Download Citation

Ngan Yeow Goh and L. Cheng "Measuring toughness of copper-bismaleimide traizine interface by peel test", Proc. SPIE 4317, Second International Conference on Experimental Mechanics, (13 June 2001); https://doi.org/10.1117/12.429586

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