Failure Analysis Of Multilayer Printed Circuit Boards Using Thermography

H R Stirn

doi:10.1117/12.939164

27 March 1984 Failure Analysis Of Multilayer Printed Circuit Boards Using Thermography

H R Stirn

Proceedings Volume 0446, Thermosense VI: Thermal Infrared Sensing for Diagnostics and Control; (1984) https://doi.org/10.1117/12.939164
Event: Thermal Infrared Sensing for Diagnostics and Control: Thermosense VI, 1983, Oak Brook, United States

Abstract

Modern electronic equipment presents new challenges for troubleshooting and repair to the manufacturing and test community. Higher circuit density and increased device sophistication requires that innovative new methods be developed for troubleshooting and repair. Expensive and delicate printed circuit boards cannot survive numerous part removal and replacement actions. Component and board defects must be isolated quickly, accurately and efficiently so that repairs may be made with minimum disruption to the board circuitry. Infrared digital thermography offers the promise of helping to solve some of these problems.

Citation Download Citation

H R Stirn "Failure Analysis Of Multilayer Printed Circuit Boards Using Thermography", Proc. SPIE 0446, Thermosense VI: Thermal Infrared Sensing for Diagnostics and Control, (27 March 1984); https://doi.org/10.1117/12.939164

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