Photoelastic investigation on thermal stresses in bonded structures

Jiong-Shiun Hsu; Wei-Chung Wang

doi:10.1117/12.468813

29 May 2002 Photoelastic investigation on thermal stresses in bonded structures

Jiong-Shiun Hsu, Wei-Chung Wang

Proceedings Volume 4537, Third International Conference on Experimental Mechanics; (2002) https://doi.org/10.1117/12.468813
Event: Third International Conference on Experimental Mechanics, 2002, Beijing, China

Abstract

The digital photoelastic and finite element methods were combined to clarify the interfacial stresses predicted by Suhir's theories. A special casting procedure was employed to obtain a true bi-material structures such that the theoretical assumptions can be satisfied. Through the analysis, some behaviors of the interfacial stresses were clarified. Besides, the distributions of the thermal stresses in the adherends calculated by Suhir and Timoshenko's theories were also discussed.

Citation Download Citation

Jiong-Shiun Hsu and Wei-Chung Wang "Photoelastic investigation on thermal stresses in bonded structures", Proc. SPIE 4537, Third International Conference on Experimental Mechanics, (29 May 2002); https://doi.org/10.1117/12.468813

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