Nondestructive acoustic microimaging (AMI) analysis of MEMS materials, manufacturing, and packaging

Steven R. Martell; Janet E. Semmens; Lawrence W. Kessler

doi:10.1117/12.443000

2 October 2001 Nondestructive acoustic microimaging (AMI) analysis of MEMS materials, manufacturing, and packaging

Steven R. Martell, Janet E. Semmens, Lawrence W. Kessler

Proceedings Volume 4558, Reliability, Testing, and Characterization of MEMS/MOEMS; (2001) https://doi.org/10.1117/12.443000
Event: Micromachining and Microfabrication, 2001, San Francisco, CA, United States

Abstract

The main type of Acoustic Micro Imaging (AMI) system utilized in this study was the C-Mode Scanning Acoustic Microscope, which is a reflection mode instrument. In this paper we describe the method and application of AMI at frequencies beyond 200 MHz, which reveals defects in the 5 micron size range at depths of 500 microns within silicon.

Citation Download Citation

Steven R. Martell, Janet E. Semmens, and Lawrence W. Kessler "Nondestructive acoustic microimaging (AMI) analysis of MEMS materials, manufacturing, and packaging", Proc. SPIE 4558, Reliability, Testing, and Characterization of MEMS/MOEMS, (2 October 2001); https://doi.org/10.1117/12.443000

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