Lead-free solder replacement: beyond the material substitution

Richard Ciocci

doi:10.1117/12.455269

11 February 2002 Lead-free solder replacement: beyond the material substitution

Richard Ciocci

Proceedings Volume 4569, Environmentally Conscious Manufacturing II; (2002) https://doi.org/10.1117/12.455269
Event: Intelligent Systems and Advanced Manufacturing, 2001, Boston, MA, United States

Abstract

Various studies have identified alternatives for tin-lead solder. Characteristics such as availability, melting point, shear strength, and solderability have led to different alternatives being recommended for different applications. The most critical effect is in reflow soldering, where tin- lead solder has been heated to 220 degree(s)C, and the recommended temperature for the alternative alloys is 260 degree(s)C. A different degree of preparation for lead-free technologies exists when comparing board subassemblies with components. Board finishes with lead-free materials have been used for years with varying success. Palladium-based component finishes have also been available, but the greatest concern for components exists in plastic-encapsulated packages. Moisture sensitivity of packages that will be heated 40 degree(s)C above current processing levels presents the potential of delamination and cracks.

Citation Download Citation

Richard Ciocci "Lead-free solder replacement: beyond the material substitution", Proc. SPIE 4569, Environmentally Conscious Manufacturing II, (11 February 2002); https://doi.org/10.1117/12.455269

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