TIS-WIS interaction characterization on overlay measurement tool

Kenji Hoshi; Eiichi Kawamura; Hiroshi Morohoshi; Hideki Ina; Takanori Fujimura; Hiroyuki Kurita; Joel L. Seligson

doi:10.1117/12.473514

16 July 2002 TIS-WIS interaction characterization on overlay measurement tool

Kenji Hoshi, Eiichi Kawamura, Hiroshi Morohoshi, Hideki Ina, Takanori Fujimura, Hiroyuki Kurita, Joel L. Seligson

Proceedings Volume 4689, Metrology, Inspection, and Process Control for Microlithography XVI; (2002) https://doi.org/10.1117/12.473514
Event: SPIE's 27th Annual International Symposium on Microlithography, 2002, Santa Clara, California, United States

Abstract

Modern overlay metrology tools achieve the required metrology accuracy by controlling critical asymmetries in the imaging optics, and by compensating for the remaining asymmetries through TIS-calibration. We extend our study on the TIS-WIS interaction in stepper alignment optics to the overlay metrology tool, and propose a new method for characterizing residual TIS. This method is based on the examination of the through-focus behavior of the metrology tool on a wafer with a simple, TIS-sensitive structure.

Citation Download Citation

Kenji Hoshi, Eiichi Kawamura, Hiroshi Morohoshi, Hideki Ina, Takanori Fujimura, Hiroyuki Kurita, and Joel L. Seligson "TIS-WIS interaction characterization on overlay measurement tool", Proc. SPIE 4689, Metrology, Inspection, and Process Control for Microlithography XVI, (16 July 2002); https://doi.org/10.1117/12.473514

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