Development of a new 1x4 micro-optical switch

Zhiping Wang; Xue Chuan Shan; Z. P. Wang; Siak-Piang Lim; K. H. Lee; Wilfried Noell; Nico F. de Rooij

doi:10.1117/12.462854

19 April 2002 Development of a new 1x4 micro-optical switch

Zhiping Wang, Xue Chuan Shan, Z. P. Wang, Siak-Piang Lim, K. H. Lee, Wilfried Noell, Nico F. de Rooij

Proceedings Volume 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002; (2002) https://doi.org/10.1117/12.462854
Event: Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, 2002, Cannes-Mandelieu, France

Abstract

In this paper, we report the development of a new 1X4 micro optical switching device which utilizes electrostatic actuation and vertical silicon mirrors. This device is fabricated using a bulk micromachining process, which allows the fabrication of vertical mirrors and U-grooves through deep reactive ion etching (DRIE) of silicon. A limited number of process steps are required in the fabrication. Moreover, the device is patterned in a single lithographic step. A relatively high yield (up to 70%) is achieved during the microfabrication due to this compact process flow. More importantly, a small footprint (<13mm² in die size) is realized. A single mode fiber with a tapered end is placed into a U-groove and positioned passively by a fiber stopper, prior to adhesive bonding with a silicon substrate and a glass cover. Preliminary characterization on the mechanical and optical performance of this device has been carried out, which reveals the promising characteristics of this 1X4 optical switch for use in optical networks.

Citation Download Citation

Zhiping Wang, Xue Chuan Shan, Z. P. Wang, Siak-Piang Lim, K. H. Lee, Wilfried Noell, and Nico F. de Rooij "Development of a new 1x4 micro-optical switch", Proc. SPIE 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, (19 April 2002); https://doi.org/10.1117/12.462854

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