Novel perfluorocyclobutane (PFCB)-containing polymers and dendrimers for photonic devices

Hong Ma; Sharon Wong; Seok Ho Kang; Jingdong Luo; Marnie Haller; Alex K.Y. Jen; Richard R. Barto; Curtis W. Frank

doi:10.1117/12.450464

25 November 2002 Novel perfluorocyclobutane (PFCB)-containing polymers and dendrimers for photonic devices

Hong Ma, Sharon Wong, Seok Ho Kang, Jingdong Luo, Marnie Haller, Alex K.Y. Jen, Richard R. Barto, Curtis W. Frank

Proceedings Volume 4805, Design and Fabrication of Planar Optical Waveguide Devices and Materials; (2002) https://doi.org/10.1117/12.450464
Event: International Symposium on Optical Science and Technology, 2002, Seattle, WA, United States

Abstract

A wide variety of aromatic trifluorovinyl ether monomers and highly fluorinated crosslinkable dendrimers have been developed via novel synthetic strategies. Through the thermal dimerization of trifluorovinyl ether moieties on the monomers or on the periphery of dendrimers, these monomers or dendrimers can be melt or solution polymerized to form perfluorocyclobutane(PFCB)-containing prepolymers with good processability for optical waveguide fabrication. By further thermal crosslinking, the resulting thermoset materials possess low optical loss (0.3-0.4 dB/cm at 1310 nm with 1% of DR-1 or DCM doping), high thermal stability (T_g: 100-400 °C), good thermo-optic property, high solvent and humid resistance, and excellent mechanical flexibility. The combination of processability and performance in these PFCB-containing thermoset materials make them as ideal candidates for the fabrication of high-performance polymeric planar lightwave circuit components with the applications in the telecom and datacom optical networks.

Citation Download Citation

Hong Ma, Sharon Wong, Seok Ho Kang, Jingdong Luo, Marnie Haller, Alex K.Y. Jen, Richard R. Barto, and Curtis W. Frank "Novel perfluorocyclobutane (PFCB)-containing polymers and dendrimers for photonic devices", Proc. SPIE 4805, Design and Fabrication of Planar Optical Waveguide Devices and Materials, (25 November 2002); https://doi.org/10.1117/12.450464

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