Laser ablation for MEMS microfabrication on Si and Kapton substrates

B. Lan; Ming Hui Hong; Kaidong D. Ye; Shi Xin Chen; Tow Chong Chong

doi:10.1117/12.486521

19 February 2003 Laser ablation for MEMS microfabrication on Si and Kapton substrates

B. Lan, Ming Hui Hong, Kaidong D. Ye, Shi Xin Chen, Tow Chong Chong

Proceedings Volume 4830, Third International Symposium on Laser Precision Microfabrication; (2003) https://doi.org/10.1117/12.486521
Event: LAMP 2002: International Congress on Laser Advanced Materials Processing, 2002, Osaka, Japan

Abstract

Laser-ablation-based microfabrication technology is applied to fabricate micro-electro-mechanical-systems (MEMS) devices on polymer substrates. A micromachining apparatus is designed and developed which includes a 355 nm laser, an uncoated focusing lens, computer-controlled precision x-y-z stages and in-situ process monitoring systems. Concentric rings microstructures are formed by efficiently changing the laser intensity distribution. Tiny via holes and micro-nozzles with different diameters have been obtained by low power laser direct drilling. Optical microscopy and scanning electron microscopy (SEM) are used to evaluate the processing results at different laser processing parameters. This method has the advantages of low-cost and time-saving in circle via holes fabrications. Potential applications of this novel MEMS fabrication technique are also briefed.

Citation Download Citation

B. Lan, Ming Hui Hong, Kaidong D. Ye, Shi Xin Chen, and Tow Chong Chong "Laser ablation for MEMS microfabrication on Si and Kapton substrates", Proc. SPIE 4830, Third International Symposium on Laser Precision Microfabrication, (19 February 2003); https://doi.org/10.1117/12.486521

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