Optical components and their packaging/module trends for WDM communication

Achyut Kumar Dutta; Masahiro Kobayashi

doi:10.1117/12.475560

11 July 2002 Optical components and their packaging/module trends for WDM communication

Achyut Kumar Dutta, Masahiro Kobayashi

Proceedings Volume 4870, Active and Passive Optical Components for WDM Communications II; (2002) https://doi.org/10.1117/12.475560
Event: ITCom 2002: The Convergence of Information Technologies and Communications, 2002, Boston, MA, United States

Abstract

The application area of optical communication is expanding from trunk lines to subscriber loops, and local area networks (LAN). Optical components and their packaging technology also vary based on different application area. This paper describes the trends of key optical components and their packaging/module technologies for WDM application. The state-of-the art of technologies for 10Gb/s and 40Gb/s application are also included. Finally, future, module technologies will also be addressed.

Citation Download Citation

Achyut Kumar Dutta and Masahiro Kobayashi "Optical components and their packaging/module trends for WDM communication", Proc. SPIE 4870, Active and Passive Optical Components for WDM Communications II, (11 July 2002); https://doi.org/10.1117/12.475560

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